LNP™ THERMOCOMP™ COMPOUND PF00ASXS is Nylon 6 resin containing 50% glass fiber. Added features of this grade include: Heat Stabilized.

ULTEM™ RESIN 1010 is an unreinforced amorphous polyetherimide (PEI) resin that may offer a high glass transition temperature (Tg) of 217°C and improved flow. Features are excellent mechanical, electrical and dimensional properties up to high temperatures. The material may offer very good chemical resistance for an amorphous material and is inherently flame retardant offering UL94 V0 and 5V ratings.

NORYL SA9000 resin is a modified, low molecular weight, bi-functional oligomer based on polyphenylene ether (PPE) with vinyl end-groups. It is well suited for use with other unsaturated monomers and resins which cure via free radical reactions. These include styrenic, allylic, acrylic, maleimide, methacrylic, and unsaturated polyesters monomers and resins. It has a low solution viscosity and outstanding solubility in toluene & methyl ethyl ketone (MEK). Key application areas are in electronic packaging which include PCB laminates, copper clad laminates, non-epoxy prepregs, and adhesives. The use of NORYL SA9000 is especially advantageous in insulating materials where very low dielectric properties and decreased moisture absorption are required.

BISDA-1000(4,4-Bisphenol A Dianhydride) (dianhydrides of BPA) can be used as a comonomer in polyimide synthesis or as an anhydride curing agent in epoxy. When used as an epoxy curative, BISDA can be used to enhance thermal performance in comparison to mono anhydrides and aromatic amine curing agents. Application areas include electronics encapsulation, composites, and adhesives. BISDA derived polyimide varnishes, coatings, adhesives, films and wire enamels meet desired solubility/stability in organic solvents even after complete imidization, heat resistance, flexibility/softness, dimensional stability and adhesion properties for ever-increasing design complexity of electronics devices.