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Customer Support

Layanan Pengaduan Konsumen, PT DKSH Indonesia,

(Business Unit Performance Materials, Sales Support Team)

Address

Gedung AIA Central, Level 39, Jl. Jend. Sudirman Kav. 48A, Jakarta Selatan, Indonesia

+62 21 2988 8557

[email protected]

Direktorat Jenderal Perlindungan Konsumen dan Tertib Niaga Kementerian Perdagangan Republik Indonesia

0853 1111 1010
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MITSUBISHI MATERIALS
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MITSUBISHI MATERIALS

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MITSUBISHI MATERIALS
SULA LIQUID-TS-AG-S

Silver-containing plating additive offering stable silver deposition in electronic applications. Balanced formulation ensures precision and consistency in coating.

Quote request
MITSUBISHI MATERIALS
SULA LIQUID TS-TIN24

Tin-based plating additive with high tin content for enhanced coating performance. Designed for semiconductor and electronics applications requiring conductive finishes.

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MITSUBISHI MATERIALS
SULA LIQUID TS-140AD

Specialized additive for semiconductor processing, improves deposit quality and plating performance. Designed for high-purity applications. Minimal hazard under normal use.
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MITSUBISHI MATERIALS
SULA LIQUID TS-AG-S-2

Advanced additive formulation used in silver plating for semiconductor and electronic applications. Optimized for conductivity and adhesion.
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MITSUBISHI MATERIALS
SULA LIQUID TS-ACID

High-performance acidic additive used in electronic chemical processes. Supports etching and surface preparation with high purity requirements.
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MITSUBISHI MATERIALS
SULA LIQUID TS-SLG

Flammable surfactant solution containing methanol and pyrocatechol. Designed for plating with properties targeting enhanced adhesion and surface leveling. Requires strict safety handling.
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