KH-700 is a waterborne curing agent designed for Hardener of liquid Epoxy Resin. KH-700 is used as a water dispersible curing agent in combination with conventional liquid Epoxy and waterborne Epoxy Resins to form waterborne epoxy paints.

KH 30 01 [2,4,6 Tris(Dimethylaminomet hyl )Phenol] is a versatile curing agent for epoxy resins, both in its own right and also as an activator of other curing agent, including carboxylic acid anhydrides, amine adducts and polyamides. It is also the preferred curing agent for blends of liquid epox ide resin and liquid polysulphides.

EPIOL-PE 311 is glycerin and polyglycerin polyglycidyl ether type epoxy resin that is compatible with various water-based resins. PE311E epoxy resin will impart both higher reactivity and cross-link density to epoxy resin formulations. PE311E epoxy resin is low viscosity, relatively high equivalent weight and aliphatic structure suggest use as a diluent and/or flexibilizer in high viscosity, brittle epoxy formulations. PE 311E epoxy resin impr­ oves elongation and peel strength and resistance to thermal cycling and impact. Depending on the con­ centration of PE 311E your formulation may experience PE 311E epoxy resin functionality permits them to cross-link with hardener and become part of the cured system.

KF EPIOL-ME 101 is the monoglycidyl ether of a na­ turally ot urrihg Cl.2-C14 aliphatic alcohol. The primary use of ME 101 is as a reactive diluent for high viscosity epoxy resin. ME 101 is compatible at' all concentrations with th­ ose resins and the blends can be cured using any epoxy resin curing agent.

KF EPIOL-ME 101B is the monoglycidyl ether of a na­ turally occurring C12-C14 aliphatic alcohol. The primary use of ME 101B is as a reactive diluent for high viscosity epoxy resin. ME 101B is compatible at all concentrations with th­ ose resins and the blends can be cured using any epoxy resin curing agent.

KF EPIOL--ME704 is a commercial grade, p-tertiary butyl phenyl glycidyl ether. It is primarily used as a viscosity reducing modifier in epoxy systems and is particularly useful in epoxy applications requiring combinations of good electrical properties, low viscosity, low volatility and/or low levels.