SPI 8238 is a low viscosity modified amine. It can be used to accelerate and provide viscosity reduction for other modified epoxy curing agents including polyamides and amidopolyamines. SPI 8238 will cure epoxy blends at temperatures of 50 °F and above.

SPI 8265 is a cycloaliphatic amine adduct. When used to cure epoxy resins it produces ambient cured coatings with excellent chemical and solvent resistance. Properties can be further improved by the use of Novolac resins.

SPI 8280 PM75 is polyamide adduct cut in propylene glycol mono-methyl ether solvent at 75% NVM. SPI 8280 PM75 provides improved compatibility with liquid and solid epoxy solutions, allowing for little or no induction time maintenance coating systems. Typical of polyamides, it provides superior adhesion and corrosion resistance. SPI 8280 PM75 is a Flammable Resin Solution.

Curing agent for epoxy resins.

SPI 8303 is an accelerated amine adduct designed to provide rapid and low temperature cure. It can be employed as a standalone curing agent or as an accelerator to improve cure response or low temperature cure properties. It is compatible with amido amines, polyamides, and cycloaliphatic systems.

SPI 8381 is a modified cycloaliphatic amine epoxy curing agent and is designed for use as part of a two component epoxy system for room temperature cure. The system cures to a tough, high gloss multi-mil film with excellent adhesion to concrete and polymer floor systems. It is low viscosity and produces films that are abrasion and chemical resistant. It also exhibits good gloss and color stability.