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EPOTEC® YD 012-X-75 is a solution of unmodified low to medium molecular weight solid diglycidyl ether of bisphenol-A resin in Xylene. The dissolution of EPOTEC® YD 012 in xylene facilitates ease of handling. EPOTEC® YD 012-X-75 is used in many solvent based coating applications such as metal coatings and concrete coatings. The typical curing agents employed with this product would be polyamides or phenalkamines. When used as the sole resin or in conjunction with other resins YD 012-X-75 imparts faster drying speeds, increased flexibility and adhesion, and longer pot life, when compared to liquid epoxy resin or type 1 solid epoxy resin.
Epotec YD 011-X-75 is a solution of unmodified low molecular weight solid diglycidyl ether of bisphenol-A resin in Xylene. The dissolution of Epotec YD 011 in xylene facilitates ease of handling.
EPOTEC® TH 7525 is a medium viscosity reactive polyamide used as a curing agent for liquid or solution grade epoxy resins such as EPOTEC® YD 128 or EPOTEC® YD 011X-75 to produce room temperature curable thermoset coatings. Epotec TH 7525 is specially used in solvent based anti-corrosion coatings and shows compatibility with wide range of solvents normally used in epoxy based coatings. The reactivity of the product can be adjusted by blending with tertiary amine and the viscosity by other reactive polyamides. The coatings based on EPOTEC® TH 7525 shows good toughness and adhesion properties. Because of these properties, it finds use in various applications.