Specialty Chemicals

EPOTEC® YD 515 is a bisphenol-A liquid epoxy resin modified with reactive diluent. This resin offers lower viscosity & lower surface tension. Both these properties are advantageous while formulating. The low viscosity improves the cost effectiveness by increasing filler loading & the low surface tension improves adhesion by better substrate wetting, it also helps in better pigment wetting and thereby improve the pigment dispersion and stability. A wide variety of curing agents are available to cure this liquid epoxy resin at ambient conditions and also at elevated temperature. Sometimes systems based on this grade are post cured to improve certain characteristics such as glass transition temperature and chemical resistance.

EPOTEC® YD 012-X-75 is a solution of unmodified low to medium molecular weight solid diglycidyl ether of bisphenol-A resin in Xylene. The dissolution of EPOTEC® YD 012 in xylene facilitates ease of handling. EPOTEC® YD 012-X-75 is used in many solvent based coating applications such as metal coatings and concrete coatings. The typical curing agents employed with this product would be polyamides or phenalkamines. When used as the sole resin or in conjunction with other resins YD 012-X-75 imparts faster drying speeds, increased flexibility and adhesion, and longer pot life, when compared to liquid epoxy resin or type 1 solid epoxy resin.

Epotec YD 134 is an unmodified semi-solid epoxy resin based on Bisphenol-A. At normal room temperature of 25°C this resin has high viscosity & has no or very little flowability. This resin has molecular weight higher than standard liquid epoxy resin epotec YD 128. Due to its viscous, semi-solid nature this resin is used, normally with solvents or applied at elevated temperature to induce the flow, mainly in adhesives & protective coatings. It can also be used to modify other epoxy resins to impart or improve the toughness, flexibility, adhesion etc.

Epotec® YD 907 is a high molecular weight bisphenol-A-based solid epoxy resin, ideal for single-pack, baking-type epoxy-amino and epoxy-phenolic coatings in the packaging industry. Its high hydroxyl content and elevated softening point impart excellent hardness to coatings, making it suitable for can coatings, coil coatings, and linings for tubes and drums. Additionally, it can be utilized in the manufacturing of epoxy esters for industrial protective coatings.