特用化學品

Epotec YD 011-X-75 is a solution of unmodified low molecular weight solid diglycidyl ether of bisphenol-A resin in Xylene. The dissolution of Epotec YD 011 in xylene facilitates ease of handling.

EPOTEC® YD 515 is a bisphenol-A liquid epoxy resin modified with reactive diluent. This resin offers lower viscosity & lower surface tension. Both these properties are advantageous while formulating. The low viscosity improves the cost effectiveness by increasing filler loading & the low surface tension improves adhesion by better substrate wetting, it also helps in better pigment wetting and thereby improve the pigment dispersion and stability. A wide variety of curing agents are available to cure this liquid epoxy resin at ambient conditions and also at elevated temperature. Sometimes systems based on this grade are post cured to improve certain characteristics such as glass transition temperature and chemical resistance.

EPOTEC® YD 012-X-75 is a solution of unmodified low to medium molecular weight solid diglycidyl ether of bisphenol-A resin in Xylene. The dissolution of EPOTEC® YD 012 in xylene facilitates ease of handling. EPOTEC® YD 012-X-75 is used in many solvent based coating applications such as metal coatings and concrete coatings. The typical curing agents employed with this product would be polyamides or phenalkamines. When used as the sole resin or in conjunction with other resins YD 012-X-75 imparts faster drying speeds, increased flexibility and adhesion, and longer pot life, when compared to liquid epoxy resin or type 1 solid epoxy resin.

Epotec YD 904 is a medium molecular weight solid epoxy resin for powder coatings requiring higher flexibility and toughness. This product is also suitable for making epoxy ester resins by reacting with fatty acids in appropriate quantity for which an esterification catalyst needs to be employed. Epotec YD 904 is also employed to produce functional powder coatings by combining with appropriate curing agent.