EPOTEC® TH 7525 is a medium viscosity reactive polyamide used as a curing agent for liquid or solution grade epoxy resins such as EPOTEC® YD 128 or EPOTEC® YD 011X-75 to produce room temperature curable thermoset coatings. Epotec TH 7525 is specially used in solvent based anti-corrosion coatings and shows compatibility with wide range of solvents normally used in epoxy based coatings. The reactivity of the product can be adjusted by blending with tertiary amine and the viscosity by other reactive polyamides. The coatings based on EPOTEC® TH 7525 shows good toughness and adhesion properties. Because of these properties, it finds use in various applications.

EPOTEC® TH 7515 is a high viscosity reactive polyamide used as a curing agent for liquid or solution grade epoxy resins such as EPOTEC® YD 128 or EPOTEC® YD 011-X-75 to produce room temperature curable thermoset adhesives and coatings. EPOTEC® TH 7515 is especially used in solvent based anti-corrosion coatings and shows compatibility with a wide range of solvents normally used in epoxy based coatings. The reactivity of the mix can be adjusted by blending with accelerators such as tertiary amine. The coatings based on EPOTEC® TH 7515 shows good toughness and adhesion properties. Because of these properties, it finds use in various applications.

Epotec TH 7302 is a low viscosity modified cycloaliphatic polyamine curing agent for use with liquid epoxy resins such as epotec YD 128 to produce solvent free room temperature curable thermoset coatings, floor toppings. When formulated appropriately with epoxy resin it gives clear, hard surface resistant to variety of chemicals such as acids, alkalies, hydrocarbons, water etc. Epotec TH 7302, being cycloaliphatic, also provides better weather resistance than aliphatic polyamines.

Epotec YDF 172 is a liquid epoxy resin reaction product of Bisphenol F and epichlorohydrin. This resin provides less crystallization tendency compared with standard liquid resin.