EPOTEC® TH 7525 is a medium viscosity reactive polyamide used as a curing agent for liquid or solution grade epoxy resins such as EPOTEC® YD 128 or EPOTEC® YD 011X-75 to produce room temperature curable thermoset coatings. Epotec TH 7525 is specially used in solvent based anti-corrosion coatings and shows compatibility with wide range of solvents normally used in epoxy based coatings. The reactivity of the product can be adjusted by blending with tertiary amine and the viscosity by other reactive polyamides. The coatings based on EPOTEC® TH 7525 shows good toughness and adhesion properties. Because of these properties, it finds use in various applications.

EPOTEC® TH 7515 is a high viscosity reactive polyamide used as a curing agent for liquid or solution grade epoxy resins such as EPOTEC® YD 128 or EPOTEC® YD 011-X-75 to produce room temperature curable thermoset adhesives and coatings. EPOTEC® TH 7515 is especially used in solvent based anti-corrosion coatings and shows compatibility with a wide range of solvents normally used in epoxy based coatings. The reactivity of the mix can be adjusted by blending with accelerators such as tertiary amine. The coatings based on EPOTEC® TH 7515 shows good toughness and adhesion properties. Because of these properties, it finds use in various applications.

EPOTEC® TH 7334 is a low viscosity, low colour modified cycloaliphatic polyamine curing agent for use with liquid epoxy resins such as EPOTEC® YD 128 to produce solvent free room temperature curable thermoset coatings, floor toppings. When formulated appropriately with epoxy resin it gives clear, air free, glossy surfaces. It has high blush resistance under high humidity condition. It also provides resistance to variety of chemicals such as acids, alkalies, hydrocarbons and water.

EPOTEC® YD 515 is a bisphenol-A liquid epoxy resin modified with reactive diluent. This resin offers lower viscosity & lower surface tension. Both these properties are advantageous while formulating. The low viscosity improves the cost effectiveness by increasing filler loading & the low surface tension improves adhesion by better substrate wetting, it also helps in better pigment wetting and thereby improve the pigment dispersion and stability. A wide variety of curing agents are available to cure this liquid epoxy resin at ambient conditions and also at elevated temperature. Sometimes systems based on this grade are post cured to improve certain characteristics such as glass transition temperature and chemical resistance.