Epotec YD 011-X-75 is a solution of unmodified low molecular weight solid diglycidyl ether of bisphenol-A resin in Xylene. The dissolution of Epotec YD 011 in xylene facilitates ease of handling.

Epotec YDFM 253 is a blend of diglycidyl ether of bisphenol-A liquid epoxy resin, diglycidyl ether of bisphenol-F liquid epoxy resin and monofunctional reactive diluent. The blend greatly improves the crystallization resistance of this material as against the individual bisphenol-A or bisphenol-F based liquid epoxy resins. The reactive diluent in the blend helps in reducing the viscosity of the product so that it can be suitably formulated into high solids or even solvent free coatings and floor toppings. The reactive diluent in the blend also lowers surface tension of the product and increases pot life as well as flexibility of the system. This translates into better surface wetting, longer working time and improved toughness. Epotec YDFM 253 is compatible with all common epoxy resins in all ratios. All the common epoxy curing agents can be employed to cure epotec YDFM 253 based system. Applications • High solids and solvent free coatings • Adhesives • Solvent free self leveling flooring • Other construction applications • Marine and Industrial protective coatings

Epotec YD 125HM is a high purity bisphenol A based epoxy resin. It has lower low chlorine content and lower viscosity than standard bisphenol A liquid resin. A wide variety of curing agents are available to cure this high purity resin at ambient conditions and also at elevated temperature. It provides better chemical resistance, higher heat distortion temperature and lower electrical conductivity compared to other standard resins. Applications • Electrical castings and encapsulations • Specialty adhesives • Civil engineering and construction industry • Tooling • Filament winding

Epotec YD 134 is an unmodified semi-solid epoxy resin based on Bisphenol-A. At normal room temperature of 25°C this resin has high viscosity & has no or very little flowability. This resin has molecular weight higher than standard liquid epoxy resin epotec YD 128. Due to its viscous, semi-solid nature this resin is used, normally with solvents or applied at elevated temperature to induce the flow, mainly in adhesives & protective coatings. It can also be used to modify other epoxy resins to impart or improve the toughness, flexibility, adhesion etc.