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MITSUBISHI MATERIALS

SULA LIQUID TS-AG-S-2

Advanced additive formulation used in silver plating for semiconductor and electronic applications. Optimized for conductivity and adhesion.

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MITSUBISHI MATERIALS

SULA LIQUID TS-ACID

High-performance acidic additive used in electronic chemical processes. Supports etching and surface preparation with high purity requirements.

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MITSUBISHI MATERIALS

SULA LIQUID TS-140BASE

Surfactant-based additive for plating applications. Ensures process consistency and wettability. Colorless to light yellow liquid, non-hazardous under GHS.

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CYANOACRYLATE ADHESIVE TZ-100

CYANOACRYLATE ADHESIVE TZ-100 is a kind of chemical substance used to produce instant adhesives, which are mainly produced by Ethyl Alpha Cyanoacrylate. By adding other ingredients, it can produce a specific curing time for all types of surface adhesive with viscosity ranging from 90-120 cps.

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