FINE-BLEND EMI-100 is styrene-acrylonitrile binary random copolymer, and it has colorless bead appearance. FINE-BLEND EMI-100 is a general purpose , low molecular weight masterbatch carrier activator. It can provide superior solutions of activation for ABS, AS masterbatch carrier. Significantly increase the amount of pigment filled, accelerated masterbatch dispersion. It can solve the terminal products’ FAQ like pitting, decreased surface gloss and color difference which is due to lack of pigment dispersion. It is an ideal choice for terminal products which need excellent aesthetic effect.

FINE-BLEND® EMI-200 is styrene-acrylonitrile binary random low molecular weight copolymer, and it has colorless bead appearance. FINE-BLEND® EMI-200 is a common type of flow modifiers, which can provide excellent a melt flow solution for high-viscosity resin to ensure a molded article having fewer defects, and more glossy appearance. Especially it’s suitable PC, ABS and its alloys for applications of larger, thinner, higher gloss.

AVANSAFE DETECTOR MB is a powerful MB designed to impart detectability, by metallic and magnetic systems, to different plastics. Imparting this property allows an easy detection of packaging, pens and bridles produced with this masterbatch, in food and beverages processing facilities. Therefore, this solution prevents contamination of undesired plastic materials in processed food. This product formula has been specially designed to be introduced in a polymeric base and generate a minimal effect to its mechanical properties. Additionally, its low required dosage allows any colour formulations and it ca be applied in injection, extrusion and rotational moulding processes.

Luna-cure DDS provides excellent high temperature properties and chemical resistance, with its fine particle size provides both enhanced reactivity and constancy in cure rates vs. coarser grades. Luna-cure DDS is easily dispersible in liquid resins and activation temperature is easily adjustable.

 

Luna-cure DDS can be used in applications for:

• One Component Adhesives

• Solid Epoxy Adhesives and Powder Coatings

• Prepregs and Film Adhesives

• Electronic Potting and Encapsulating Compounds