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ITAMID FL520/S is a low viscosity polyamidoamine adduct specifically designed for epoxy flooring and civil engineering applications in conditions of high humidity and/or wet substrates. ITAMID FL520/S is the version with higher reactivity compared to ITAMID FL520.
ITAMID B70X is a high-performance poly(amidoimidazoline)amine curing agent in xylene solution, ideal for solvent-based protective coatings, epoxy primers, and civil engineering applications. Offering strong substrate adhesion, ambient temperature reactivity, and lasting chemical resistance, it’s free from benzyl alcohol, nonylphenol, salicylic acid, and bisphenol-A.
FINE-BLEND® CMG5701 is a low TVOC maleic anhydride modified polypropylene recommended for long fiber reinforced polypropylene (LFT-PP) modification. It has high graft ratio and great high temperature stability in processing. FINE-BLEND® CMG5701 can provide excellent adhesion between PP and polar substrates such as glass, metal, minerals etc. Due to the low smell and TVOC characteristics and stable high temperature process performance, it is recommended used in LFT-PP production.