S-06E is an electronic grade epoxy. It can be used as a casting resin, in LED encapsulation, insulating materials, 3D printing, carbon fibre cable cores and other composite materials, giving outstanding performance for UV resistance and anti-radiation properties. It is UV curable, thermal curable with anhydrides, high TG up to 195ºC, excellent yellowing resistance and good UV resistance, outstanding electrical insulation, low halogen and high purity and low viscosity.

S-21 is a distilled base epoxy resin for use in formulating UV-curable cycloaliphatic epoxide coatings systems. S-21 contributes to primary film properties. S-21 has both carboxylate and epoxy groups, with the potential for fast cure. S-21 is widely used in industry for the preparation of inks, resins, coatings, and encapsulation.

EPONEX RESIN 1510 is a medium viscosity hydrogenated DPP epoxy resin. EPONEX 1510 has a good chemical and UV resistance.

NC-558 is a low viscosity, solvent and benzyl alcohol free phenalkamine curing agent designed for epoxy coating applications protecting metal and concrete substrates. It has excellent rapid cure properties, even at low temperatures, offers very good chemical resistance, and provides excellent adhesion on wet or otherwise unprepared surfaces and green concrete. Heavy duty industrial, marine service, protective, floor, and potable water contact coatings can benefit from this product’s outstanding water resistance and corrosion protection.