Epotec YD 904 is a medium molecular weight solid epoxy resin for powder coatings requiring higher flexibility and toughness. This product is also suitable for making epoxy ester resins by reacting with fatty acids in appropriate quantity for which an esterification catalyst needs to be employed. Epotec YD 904 is also employed to produce functional powder coatings by combining with appropriate curing agent.

Epotec YD 019 is a high molecular weight bisphenol-A based solid epoxy resin used to make single pack, baking type epoxy-amino, epoxy-phenolic coatings that are used in packaging industry. It exhibits optimum flexibility and food chemical resistance.

Epotec YD 011-X-75 is a solution of unmodified low molecular weight solid diglycidyl ether of bisphenol-A resin in Xylene. The dissolution of Epotec YD 011 in xylene facilitates ease of handling.

Epotec TH 7320 is a low viscosity modified cycloaliphatic polyamine curing agent for use with liquid epoxy resins such as Epotec YD 128 to produce solvent free room temperature curable thermoset coatings, floor toppings. When formulated appropriately with epoxy resin it gives clear, air free, glossy surfaces. It also provides resistance to variety of chemicals such as acids, alkalies, hydrocarbons and water. Epotec TH 7320, being cycloaliphatic, also provides excellent weather resistance. It is less irritating, gives low odour, excellent transparency and light colour.