ORGASOL® 3502 D NAT 1, from Arkema, is spheroidal copolyamide 6/12 powder with a narrow particle size distribution and an average diameter of 20µm. ORGASOL® 3502 D NAT 1 has a melting temperature of 142°C. An extremely high level of quality is achieved through rigorous control of the particle size distribution & porosity, ensuring excellent consistency of performance.

ITAMID PD FL563 S is a low viscosity Poly amidoamine adduct suitable for use as a curing agent in epoxy formulations. The product is the DMAPA free version of ITAMID FL561 S. Ingredient is a curing agent to be used as a primer for flooring applications, it promotes adhesion and accelerate the epoxy systems. Ingredient has a good reactivity even at low temperature (down to 5-10°C).

875 is Thermoplastic Hot Melt adhesive, 100% solids content.

SpiderBond® 8090G is a pellet form high-performance thermoplastic hot melt copolyamide adhesive. SpiderBond® 8090G is a 100% solids adhesive with lower melting range, because of its excellent water wash resistance, dry-cleaning resistance, solvent resistance, high & low temperature resistance, this product is very widely used for textile lamination. This product can bond a variety of substrates, it is often used in the bonding of textiles, leather, foam, paper, metals and polymers