MITSUBISHI MATERIALS Products

SULA LIQUID TS-SLG

Flammable surfactant solution containing methanol and pyrocatechol. Designed for plating with properties targeting enhanced adhesion and surface leveling. Requires strict safety handling.

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SULA LIQUID TS-140AD

Specialized additive for semiconductor processing, improves deposit quality and plating performance. Designed for high-purity applications. Minimal hazard under normal use.

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SULA LIQUID TS-AG-S-2

Advanced additive formulation used in silver plating for semiconductor and electronic applications. Optimized for conductivity and adhesion.

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SULA LIQUID TS-ACID

High-performance acidic additive used in electronic chemical processes. Supports etching and surface preparation with high purity requirements.

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SULA LIQUID-ANTIFOAMER

Methanol-rich antifoam agent used to reduce and control foam in plating and electronic chemical systems. Offers safety and performance benefits with flammable properties.

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SULA LIQUID-TS-AG-S

Silver-containing plating additive offering stable silver deposition in electronic applications. Balanced formulation ensures precision and consistency in coating.

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