MITSUBISHI MATERIALS Products

SULA LIQUID TS-TIN24

Tin-based plating additive with high tin content for enhanced coating performance. Designed for semiconductor and electronics applications requiring conductive finishes.

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SULA LIQUID TS-140AD

Specialized additive for semiconductor processing, improves deposit quality and plating performance. Designed for high-purity applications. Minimal hazard under normal use.

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MITSUBISHI MATERIALS

SULA LIQUID TS-AG-S-2

Advanced additive formulation used in silver plating for semiconductor and electronic applications. Optimized for conductivity and adhesion.

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SULA LIQUID TS-ACID

High-performance acidic additive used in electronic chemical processes. Supports etching and surface preparation with high purity requirements.

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