(Business Unit Performance Materials, Sales Support Team)
Gedung AIA Central, Level 39, Jl. Jend. Sudirman Kav. 48A, Jakarta Selatan, Indonesia
+62 21 2988 8557
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EPOSIR® F 598 is a versatile epoxy resin designed for use either independently or in combination with Bisphenol A based epoxy resins. It can be combined with curing agents like polyamines-polyamides or their adducts to create high-solid or solvent-borne protective coatings, suitable for applications in civil engineering and anticorrosion.
EPOSIR® 7120 is designed to be used in combination with curing agents, such as polyamine-amides or their adducts, to create high-solid or solvent-borne protective coatings. It finds applications in civil engineering and the packaging industry.
EPOSIR® F 556 is a medium viscosity liquid epoxy resin, formulated by blending a Bisphenol A resin and a Bisphenol F resin. It is used for adhesive - solvent free and high solids coating, mortars etc.
EPOSIR® 7106 serves as a reactive diluent within epoxy resin systems, imparting flexibility to epoxy products. When combined with EPOSIR® 7120, it offers significant viscosity reduction capabilities in the epoxy formulation.
