Epotec YD 011-X-75 is a solution of unmodified low molecular weight solid diglycidyl ether of bisphenol-A resin in Xylene. The dissolution of Epotec YD 011 in xylene facilitates ease of handling.

Epotec YD 904 is a medium molecular weight solid epoxy resin for powder coatings requiring higher flexibility and toughness. This product is also suitable for making epoxy ester resins by reacting with fatty acids in appropriate quantity for which an esterification catalyst needs to be employed. Epotec YD 904 is also employed to produce functional powder coatings by combining with appropriate curing agent.

Epotec YD 019 is a high molecular weight bisphenol-A based solid epoxy resin used to make single pack, baking type epoxy-amino, epoxy-phenolic coatings that are used in packaging industry. It exhibits optimum flexibility and food chemical resistance.

EPOTEC® YD 515 is a bisphenol-A liquid epoxy resin modified with reactive diluent. This resin offers lower viscosity & lower surface tension. Both these properties are advantageous while formulating. The low viscosity improves the cost effectiveness by increasing filler loading & the low surface tension improves adhesion by better substrate wetting, it also helps in better pigment wetting and thereby improve the pigment dispersion and stability. A wide variety of curing agents are available to cure this liquid epoxy resin at ambient conditions and also at elevated temperature. Sometimes systems based on this grade are post cured to improve certain characteristics such as glass transition temperature and chemical resistance.