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SULA LIQUID-ANTIFOAMER

Methanol-rich antifoam agent used to reduce and control foam in plating and electronic chemical systems. Offers safety and performance benefits with flammable properties.

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SULA LIQUID TS-140AD

Specialized additive for semiconductor processing, improves deposit quality and plating performance. Designed for high-purity applications. Minimal hazard under normal use.

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MITSUBISHI MATERIALS

SULA LIQUID TS-AG-S-2

Advanced additive formulation used in silver plating for semiconductor and electronic applications. Optimized for conductivity and adhesion.

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MITSUBISHI MATERIALS

SULA LIQUID TS-ACID

High-performance acidic additive used in electronic chemical processes. Supports etching and surface preparation with high purity requirements.

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很抱歉，系統出現問題！請重試。

目前沒有可用的配方

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